Study Day on Bonding Technologies to Be Held on November 9, 2026
Published
The Electronics and Microelectronics Packaging Branch of the Engineers' Association and IEEE EPS Israel invite those interested to take part in a study day on bonding technologies. The invitation was published on November 4, 2026, and the study day will be held on November 9, 2026.
The study day will be dedicated to the entire value chain of the bonding world. In other words, the topic covers all stages in the field, from materials and processes to applications. Bonding is used in many industries, including the electronics and microelectronics industry, where connecting small components is an important part of the manufacturing process.
The organizers invite anyone interested in the topic to come and take part in the event. This invitation is aimed at professionals, engineers, and anyone who wants to learn about the technologies in the field.
The study day is a joint initiative of the Engineers' Association and IEEE EPS Israel. For further details on the location, the event program, and registration, it is recommended to consult the full announcement from the organizers.
Sources: Techtime
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